美国再出新规制裁华为，如计划属实，中方将予以强力反击

昨日，美国政府突然宣布即将升级制裁措施，准备阻止全球所有芯片制造商向华为公司输出半导体元件。此事影响广泛，中美贸易战将再次升级。

美国商务部正扩大对华为的制裁力度，试图切断其与全球芯片商的联系

美国此次的计划可以理解为，全世界所有的公司只要在和华为合作的业务中，使用了一定比例的美国技术和设备，就必须通过美国政府的批准。

由于海思麒麟芯片和高通、苹果一样，都是通过台湾台积电(TSMC)等芯片代工厂生产芯片产品，所以此举可能导致下半年的华为Mate40系列手机无法生产。

而华为在2019年的芯片采购金额上达到了208亿美元，仅次于苹果和三星的361亿美元和334亿美元。如若真撕破脸，全球的芯片行业都要受到很大程度的影响。

美国商务部置顶公告

该公告5月15日正式生效，在5月15日前的订单不受限制，但是必须在120日之内发货完毕，从根本上杜绝了华为公司提前备货的可能性。

此举不仅是美国政府针对华为企业的单一行为，近期接下麒麟710A处理器代工业务的中芯国际也恐受影响。

中国掌握了大量5G核心技术，目前，美国的芯片厂商高通公司在中国的收入，占其整个公司的60%。

中国高科技产业并非“砧上鱼肉”，可以任人宰割

The Bureau of Industry and Security (BIS) today announced plans to protect U.S. national security by restricting Huawei’s ability to use U.S. technology and software to design and manufacture its semiconductors abroad. This announcement cuts off Huawei’s efforts to undermine U.S. export controls. BIS is amending its longstanding foreign-produced direct product rule and the Entity List to narrowly and strategically target Huawei’s acquisition of semiconductors that are the direct product of certain U.S. software and technology. 

Since 2019 when BIS added Huawei Technologies and 114 of its overseas-related affiliates to the Entity List, companies wishing to export U.S. items were required to obtain a license.[1]  However, Huawei has continued to use U.S. software and technology to design semiconductors, undermining the national security and foreign policy purposes of the Entity List by commissioning their production in overseas foundries using U.S. equipment.

“Despite the Entity List actions the Department took last year, Huawei and its foreign affiliates have stepped-up efforts to undermine these national security-based restrictions through an indigenization effort.  However, that effort is still dependent on U.S. technologies,” said Secretary of Commerce Wilbur Ross.  “This is not how a responsible global corporate citizen behaves.  We must amend our rules exploited by Huawei and HiSilicon and prevent U.S. technologies from enabling malign activities contrary to U.S. national security and foreign policy interests.”

Specifically, this targeted rule change will make the following foreign-produced items subject to the Export Administration Regulations (EAR): 

(i)        Items, such as semiconductor designs, when produced by Huawei and its affiliates on the Entity List (e.g., HiSilicon), that are the direct product of certain U.S. Commerce Control List (CCL) software and technology; and

(ii)       Items, such as chipsets, when produced from the design specifications of Huawei or an affiliate on the Entity List (e.g., HiSilicon), that are the direct product of certain CCL semiconductor manufacturing equipment located outside the United States.  Such foreign-produced items will only require a license when there is knowledge that they are destined for reexport, export from abroad, or transfer (in-country) to Huawei or any of its affiliates on the Entity List.

To prevent immediate adverse economic impacts on foreign foundries utilizing U.S. semiconductor manufacturing equipment that have initiated any production step for items based on Huawei design specifications as of May 15, 2020, such foreign-produced items are not subject to these new licensing requirements so long as they are reexported, exported from abroad, or transferred (in-country) by 120 days from the effective date.

Federal Register notice of the interim final rule is available here.